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Epoxy resin molding compound - List of Manufacturers, Suppliers, Companies and Products

Epoxy resin molding compound Product List

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High-Temperature Resistant Epoxy Resin - Information on Molding Materials

High-Temperature Resistant Epoxy Resin - Information on Molding Materials

Introducing high heat-resistant epoxy resin molding materials applicable to electric vehicles and home appliances!

We offer high heat-resistant epoxy resin molding materials applicable to electric vehicles and home appliances. We have a variety of products including precision mechanical components, packaging, injection molding materials, and high heat-resistant, heat shock-resistant sealing materials. Please feel free to contact us if you have any requests. 【Product Lineup】 ■ Precision mechanical components, packaging, injection molding materials ■ High heat-resistant, heat shock-resistant sealing materials ■ Base resin for magnetic material formulations (for molding materials) ■ For high voltage components *For more details, please download the PDF or contact us.

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Low-temperature low-pressure molding epoxy resin molding material "KT-17 C20"

Low-temperature low-pressure molding epoxy resin molding material "KT-17 C20"

Suitable for transfer, injection, and compression molding! Molding materials that can be formed at around 120°C.

The "KT-17C20" is an epoxy resin molding material for low-temperature, low-pressure molding that enables molding in temperature ranges that were difficult with conventional molding materials. It can be molded at around 120°C, and due to its low-pressure molding capability and high fluidity, productivity is improved without the need for a case. Additionally, since the molding pressure and temperature are low, there is no deformation or damage to the mounted components, making it suitable for the molding and sealing of mounted components that are sensitive to heat and stress. 【Features】 ■ Molding possible at around 120°C ■ Low-pressure molding capability ■ High fluidity ■ Low-temperature curing ■ Ultra-low-pressure sealing *For more details, please refer to the PDF document or feel free to contact us.

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Epoxy resin molding material "OR-40 Magnetic Property Improved Grade"

Epoxy resin molding material "OR-40 Magnetic Property Improved Grade"

Applicable to both compression molding and transfer molding! Can adapt to various molding equipment.

The "OR-40 Magnetic Property Improved Grade" is a magnetic powder blended epoxy resin molding material. It exhibits excellent heat resistance due to its high glass transition temperature. Additionally, it is highly filled with magnetic powder, resulting in good magnetic properties. Please feel free to contact us when you need assistance. 【Features】 ■ Exhibits excellent heat resistance due to its high glass transition temperature ■ Highly filled with magnetic powder, resulting in good magnetic properties ■ Applicable for both compression molding and transfer molding, adaptable to various molding equipment *For more details, please refer to the PDF document or feel free to contact us.

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Injection molding epoxy resin material "TM-250"

Injection molding epoxy resin material "TM-250"

Low-pressure forming is possible! Molding materials suitable for parts requiring sub-micron level precision.

The "TM-250" is an injection molding epoxy resin material suitable for parts requiring sub-micron level precision. It is applicable for precision mechanical components, resin cases, and device encapsulation. We also offer molding materials such as "TM-261," which enables high dimensional accuracy, and "YD8000T," characterized by ultra-low shrinkage. 【Features】 ■TM-250 ・Can be molded under low pressure ■TM-261 ・High dimensional accuracy ■YD8000T ・Ultra-low shrinkage *For more details, please refer to the PDF document or feel free to contact us.

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